Quadrionix

PCB Assembly Services (SMT, THT & Mixed Technology Builds)

PCB assembly is the process of placing and soldering electronic components onto a fabricated printed circuit board to create a functional electronic system. At QUADRIONIX, PCB assembly is executed as an engineering-aligned process, where component placement, soldering profiles, and inspection workflows are planned to match the design intent and functional requirements of the product. We support global product teams requiring reliable PCB assembly services from India, with controlled execution, clear communication, and alignment across design, sourcing, and validation stages. Fabricated boards are supplied through our PCB Fabrication services for assembly execution.

PCB Assembly Services (SMT, THT & Mixed Technology Builds)

Service Overview

Our PCB assembly services are designed for builds where accuracy, repeatability, and functional reliability are critical.

We support

  • Engineering prototypes
  • Pilot production runs
  • Low-to-medium volume builds

It is aligned with

  • PCB design constraints
  • Component characteristics
  • Validation and testing requirements

Assembly is not treated as a standalone activity. This ensures that assembled boards are not only complete — but functionally stable and production-ready. Assembly readiness is validated through our PCB Design Review & DFM services before production.

Overview Visual
Capabilities

Technical Specifications

We support Surface Mount Technology (SMT), Through-Hole Technology (THT), and mixed assemblies.

01

Assembly Types

Surface Mount Technology (SMT), Through-Hole Technology (THT), Mixed technology assemblies

02

Component Handling

Fine-pitch components, BGA and dense packages, double-sided assembly, High component density layouts. Components are sourced and validated through our BOM Risk and Optimization services to reduce supply risks.

03

Build Types

prototype and engineering builds, pilot production, low-to-medium volume manufacturing

stencil alignment and solder paste application
reflow soldering and selective soldering
component placement validation
handling of sensitive and critical components

Pre-production verification

Every project is reviewed before production so design intent, manufacturability, and yield risks are understood early.

Engineering review visual
01

Design Alignment

design-for-assembly (DFA) review, component placement feasibility, spacing and accessibility for assembly

02

Thermal & Process

reflow profile alignment, thermal sensitivity of components, solder joint reliability

03

Test Readiness

test point accessibility, fixture feasibility, validation planning

04

Risk Identification

component-related risks, assembly constraints, potential reliability issues. This reduces: assembly defects, functional failures, iteration cycles during validation

INSPECTION VERIFICATION PROTOCOL

Quality & Inspection

Fabrication quality is aligned with engineering intent through controlled inspection, process monitoring, and trace parameters auditing.

01
Automated Optical Inspection (AOI)
02
X-ray inspection for complex packages (where required)
03
visual inspection
04
process validation checks
05
IPC-referenced assembly practices (where applicable)
06
consistency across builds and batches
Quality Inspection
Component Procurement

Component Sourcing Approach

Assembly can be supported through multiple sourcing models depending on project requirements.

Client-Supplied Components

Procure and supply your own components directly for assembly.

Partial Sourcing Support

We source critical, long-lead, or local parts, while you supply the remaining bill.

Full Sourcing Under Turnkey Model

Complete supply chain ownership including procurement, verification, and execution.

Supply Chain Validation Criteria

All sourced components undergo engineering validation to prevent assembly blockages and ensure manufacturing reliability. We rigorously evaluate:

availability and lead times
lifecycle status
authenticity and sourcing risk

Applications

Where our execution makes a difference

01

IoT & Connected Devices

High-density SMT assembly for small footprint, wireless, and power-optimized hardware.

02

Industrial Control Systems

Robust SMT and THT mixed technology assemblies built for process automation environments.

03

Instrumentation Electronics

High-fidelity analog and mixed-signal assemblies built with strict testing profiles.

04

Product Validation Builds

Precision assembly runs built exactly to spec to identify component tolerances early.

05

Pilot Production Programs

Scale-ready production runs with process traceability and yield audits.

Scope & Focus Areas

We clearly define our manufacturing limits to align engineering capabilities with execution quality.

Supported
Scope.

  • 01prototype to medium-volume assembly
  • 02engineering-driven builds
  • 03assemblies requiring validation and control

Out Of
Bounds.

  • 01ultra-high-volume automated production
  • 02cost-only driven assembly requirements
  • 03fully self-service ordering workflows

Engagement Process

A structured, engineering-led workflow ensuring technical correctness from initial gerbers to export delivery.

01

Submit BOM, Gerber, and pick-and-place files

Engineering review and clarification

02
03

Assembly planning and process alignment

04

Production and inspection

Delivery with documentation

05

Frequently Asked Questions

Clear answers regarding our process, capabilities, and execution boundaries.